4Wave. Thin Film Processing, Dielectric, Alloys, Nitrides, Metals, Garnets, III-V Materials. GaN, Photovoltaic, Infrared, LED Devices

	CUTTING EDGE PRODUCTS
	Deposition System
	Etch System
	Specialty System
	Mini (De) Mux Chip
	4 Channel ROSA
	Optical Monitors

	ONE-STOP SERVICES
	Optical Thin Film Coatings
	Thin Film Coatings
	Design & Prototyping
	System Refurbishment
	Engineering

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	INNOVATIVE R&D
	Biased Target Deposition
	In-situ Process Monitoring
	Dynamic Process Compensation
	Ion Beam Deposition
	Ion Beam Etch
	Direct IBD
	Ion-Assisted Evaporation

THIN FILM PROCESSING

4Wave offers metallic, nitride and dielectric thin films using both Ion Beam Sputtering and Biased Target Deposition techniques. 4Wave can provide custom multilayer stacks of various materials and alloys.

Process Equipment :

Load Lock Ion Beam Deposition System up to 150mm wafers (Metal or Dielectric Films)
Load Lock Biased Target Despoition System up to 150mm wafers (Dielectric, metal, co-deposition of up to 2 targets mixed with oxygen)
Load Locked Biased Target Deposition System up to 200mm wafers. (Dielectric Films, Optical filters)
Batch Biased Target Deposition System up to 100mm wafers. (Dielectric, metal, co-deposition of up to 3 targets mixed with oxygen)
Batch Biased Target Deposition System up to 150mm wafers. (Dielectric, metal, co-deposition of up to 2 targets mixed with oxygen)

Metrology Equipment:

PerkinElmer Lanbda 950 UV/VIS Spectrometer (Transmition and Reflection)

Tencor P12 Profilometer and Stress Measurement

Sentech SE850 UV/VIS Mapping Elipsometer

Prometrix Resistivity Mapper

Macbeth TD929 Densitometer

Olympus BX60M Microscope with Digital Camera

Agilent 86100A Wide Bandwidth Osciloscope with 86105A 1000nm-1600nm

Agilent 86130A Error Perfromance Analyser

Agilent 86142B Optical Spectrum Analyser

Agilent 8164B Lighwave Measurement System with

81633A Power Sensor
81600B Tunable Laser

Nettest Tunable Lasers (1300nm 50nm and 1550nm 50nm)

Bede 200 XRD

Films:

High Purity Dense Metalic, Conformal Coatings:
- Ag, Ta, NiFe, Cr, Cu, Co, FeMn, V, Hf, Gd, Sc, C, Zn, Sn, Mn, TiN, TaN, Ti
Dielectric films by reactive sputtering: fully dense, amorphous, conformal coatings:
- SiO2, TiO2, Ta2O5, Al2O3, HfO2, V2O5, VO2, AgO, MgO
Nitride films by reactive sputtering: fully dense, amorphous, conformal coatings:
- AlN, SiN (High or Low Stress), HfN
- GaN (n and p) InGaN, AlGaN (Amorphous, Polychristaline, Monochrystaline)
Alloys:
- Garnet Materials:Up to 4 Metalic Materials of various componsitions with oxides
- High-K Materials
Various Sheet Rhos:
- TaNx, VOx (Varaying TCR and Sheet Resistance), TiNx
TEM Cross Section

TEM cross-section of XYO3 deposited on Ge

Gallium Nitride

3 Layer 4 Element Garnet Material

200mm Deposition