CUTTING EDGE PRODUCTS
Deposition System
Etch System
Mini (De)Mux Chip
4 Channel ROSA
Laser end point detectors
Optical monitors
ONE-STOP SERVICES
Engineering
Design & Prototyping
Plasma Source Refurbishment
System Refurbishment
Thin Film Processing
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INNOVATIVE R&D
Biased Target Deposition
In-situ Process Monitoring
Dynamic Process Compensation
Ion Beam Deposition
Ion Beam Etch
Direct IBD
Ion-Assisted Evaporation
 

ENGINEERING SERVICES

PROCESS ENGINEERING

We help diagnose process irregularities, design process experiments, evaluate the structural and chemical properties of thin films, and develop custom process solutions. We have extensive experience in ion beam deposition, direct ion beam deposition (PECVD), sputter deposition, ion beam etch, and reactive ion beam etch applications. We provide the following process development services:

  • Dielectric films by reactive sputtering: fully dense, amorphous, stable materials such as SiO2, TiO2, Ta2O5, Al2O3
  • Carbon films: diamond like carbon, amorphous carbon, hard and soft carbon films
  • Metals: metallization for MEMs, MMICs, semiconductors, magnetic devices, optical components
  • Magnetic materials: magnetoresistive thin films (GMR, spin valves, AMR), magnetic thin films (soft/hard magnetic materials)
  • Specialty materials: ITO, YBCO, TBCCO
  • Ion beam etch for refractory materials, device definition and trim, waveguide definition and other applications
  • Optical interference stacks, including design
  • Ion beam PE-CVD deposition of thick SiO2 for waveguide (sputter doped)
  • In-situ process and wafer sensors for end-point detection and process control
  • Device, lithography and process interaction and optimization
  • Thermal management, particle control, ESD specialists

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