Product Description
The 4Wave ion beam sputtering cluster tool has maintained 4Wave’s 95% market share in the Vanadium Oxide Processing community (MEMS Market).
Markets Include:
- Semi-Conductor
- MEMS
- Data Storage
- Optics
- Wafer processing services
Applications:
- Thermal Imaging
- EUV Mask
- Magnetic Tunnel Junctions
White Papers:
Publications:
Features:
- Low Energy Gridless Plasma Source
- Ion Assisted deposition (Gridless or Gridded Source)
- Hollow Cathode Electron Source
- 6 x 8″ or 3 x 12″ or 2 x 16 “biased target carousel
- Pulse DC target from 1Hz to 250Khz up to -1300V
- Up to 200mm diameter process surface
- <3% non-uniformity
- Closed loop control of film properties
- Substrate plasma cleaning, etching oxidation, nitridation
- Water cooled, tilting, rotating, magnetic shuttered stage
- Robotically loaded, optically aligned wafers
- Load lock with up to 25 wafers
- RF Gridded Plasma Source
- Ion Assisted deposition (Gridless or Gridded Source)
- Plasma Bridge Electron Source
- 6 x 8″ or 3 x 12″ or 2 x 16″ target carousel
- Up to 200mm diameter process surface
- <3% non-uniformity
- Closed loop control of film properties
- Substrate plasma cleaning, etching oxidation, nitridation
- Water cooled, tilting, rotating, magnetic shuttered stage
- Robotically loaded, optically aligned wafers
- Load lock with up to 25 wafers